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smd b EASR3212RGA4 features ? package in 8mm tape on 7 diameter reel. ? compatible with automatic placement equipment. ? compatible with infrared and vapor phase reflow solder process. ? multi-color type. ? pb-free. ? the product itself will remain within rohs compliant version. ? compliance with eu reach ? compliance halogen free .(br <900 ppm ,cl <900 ppm , br+cl < 1500 ppm). description ? ? the easr3212 smd led is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. besides, lightweight makes them ideal for miniature applications. etc. applications ? backlighting in dashboard and switch. ? telecommunication: indicator and backlighting in telephone and fax. ? flat backlight for lcd, switch and symbol. ? general use. page 1 of 11 rev. 0.03
device selection guide code chip materials emitted color resin color r6 algainp brilliant red water clear gh ingan brilliant green absolu te maximum ratings (ta=25 ) parameter symbol code rating unit reverse voltage v r 5 v forward current i f r6 25 m a gh 25 eak forward current (duty 1/10 @1khz) i fp r6 60 m a gh 100 power dissipation pd r6 60 mw gh 95 electrostatic discharge esd hbm r6 200 0 v gh 150 operating temperature t opr -40 ~ +85 storage temperature tstg -40 ~ +90 soldering temperature tsol reflo w soldering : 260 for 10 sec. hand s oldering : 350 for 3 sec. datasheet smd-b EASR3212RGA4 page 2 of 11 rev. 0.03
electr o-optical characteristics (ta=25 ) parameter symbol code min. typ. max. unit condition luminous intensity iv r6 45.0 ----- 112.0 mcd i f =20ma gh 140.0 ----- 285.0 viewing angle 2 1/2 ----- 130 ----- deg peak wavelength p r6 --- -- 624 ----- nm gh ----- 518 ----- dominant wavelength d r6 --- -- 632 ----- nm gh 520 ----- 535 spectrum radiation bandwidth r6 --- -- 20 ----- nm gh ----- 35 ----- forward voltage v f r6 1.7 2.0 2.4 v gh 2.7 3.3 3.7 reverse current i r r6 ---- - ----- 10 a v r =5v gh ----- ----- 50 note: 1.tolerance of luminous intensity: 11% 2.tolerance of dominant wavelength 1nm datasheet smd-b EASR3212RGA4 page 3 of 11 rev. 0.03
bin range of luminous intensity r6 bin code min. max. unit condition p1 45.00 57.00 mcd i f =20ma p2 57.00 72.00 q1 72.00 90.00 q2 90.00 112.00 bin ra nge of luminous intensity gh bin code min. max. unit condition r2 140 180 mcd i f =20ma s1 180 225 s2 225 285 bin ra nge of dom. wavelength gh bin code min. max. unit condition x 520.0 525.0 nm i f =20ma y 525.0 530.0 z 530.0 535.0 note: 1.tolerance of luminous intensity: 11% 2.tolerance of dominant wavelength 1nm datasheet smd-b EASR3212RGA4 page 4 of 11 rev. 0.03
typical electro-optical characteristics curves r6 datasheet smd-b EASR3212RGA4 page 5 of 11 rev. 0.03
typical electro-optical characteristics curves gh datasheet smd-b EASR3212RGA4 page 6 of 11 rev. 0.03
package dimension note: tolerances unless mentioned 0.1mm. unit = mm datasheet smd-b EASR3212RGA4 page 7 of 11 rev. 0.03
moisture resistant packing materials label explanation ? cpn: customer?s product number ? p/n: product number ? qty: packing quantity ? cat: luminous intensity rank ? hue: chromaticity coordinates & dom. wavelength rank ? ref: forward voltage rank ? lot no: lot number reel dimensions note: the tolerances unless mentioned is 0.1mm ,unit = mm rohs pb cpn : p n : xxxxxxxxxxxxx xxxxxxxxxxxxx qty : xxx lot no : xxxxxxxxxx reference : xxxxxxxx cat : xxx hue : xxx ref : xxx everlight made in taiwan datasheet smd-b EASR3212RGA4 page 8 of 11 rev. 0.03
carrie r tape dimensions: loaded quantity 2000 pcs per reel note: the tolerances unless mentioned is 0.1mm ,unit = mm moisture resistant packaging label desiccant label aluminum moisture-proof bag datasheet smd-b EASR3212RGA4 page 9 of 11 rev. 0.03
precau tions for use 1. over-current-proof custo mer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package: the leds should be kept at 30 or less and 90%rh or less. 2.3 af ter opening the package: the led's floor life is 1 year under 30 or less and 60% rh or less. if unu sed leds remain, it should be stored in moisture proof packages. 2.4 if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 5 for 24 hours. 3. soldering condition 3.1 pb-free solder temperature profile p re-heating 1 50~ 20 0c 6 0~ 12 0sec. a bo ve 2 17 c 60 ~ 15 0sec. 26 0c m ax. 10 sec. m ax. 6c /sec.m ax . a bo ve2 55 c 30 sec.m ax. 3 c /sec.m ax. 3.2 re flow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. 4.soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. be careful because the damage of the product is often started at the time of the hand solder. 5.repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used (as below figure). it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. datasheet smd-b EASR3212RGA4 page 10 of 11 rev. 0.03
applic ation restrictions high r eliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. if you have any concerns, please contact everlight before using this product in your application. this specification guarantees the quality and performance of the product as an individual component. do not use this product beyond the specification described in this document. datasheet smd-b EASR3212RGA4 page 11 of 11 rev. 0.03

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